Intel Launches AI-Powered Chipset For Software-Defined Vehicles, Announces New Automotive Partnerships

Intel has unveiled the second-generation Intel AI-enhanced software-defined vehicle system-on-chip, claiming that it is the automotive industry's first multi-process node chiplet architecture. The new SoC was launched at Intel's debut at Auto Shanghai. 

The SoC is engineered to meet the growing demands of intelligent, connected vehicles, providing automakers performance, advanced AI capabilities and cost efficiency, Intel said. The company also announced new collaborations with automotive innovators ModelBest and Black Sesame Technologies. 

The partnerships will help the company to expand its automotive ecosystem and accelerate innovation in AI-powered cockpits, integrated advanced driver-assistance systems solutions and energy-efficient vehicle compute platforms, it said.

The second-generation Intel SDV SoC is the automotive industry's first to leverage a multi-node chiplet architecture, enabling automakers to tailor compute, graphics and AI capabilities to their needs. According to Intel, the architecture offers:

• Up to 10x AI performance for generative and multimodal AI.

• Up to 3x graphics performance for richer human-machine interface experiences.

• 12 camera lanes for increased camera input and image processing capabilities.

• ModelBest: ModelBest's GUI Intelligent Agent leverages on-device large language models and is powered by Intel's SDV SoC and Intel Arc graphics. It enables offline, AI-enhanced voice control and personalised interaction, even without network connectivity. The agent improves voice interaction by accurately understanding natural language.

• Black Sesame Technologies: Combining its ADAS technology with Intel's SDV SoC and Intel Arc graphics for automotive, Black Sesame is developing a central compute platform that fuses ADAS and immersive cockpit experiences into one energy-efficient system, with stable, high-speed, low-latency connections.

"Intel is redefining automotive compute with our second-generation SDV SoC, combining the flexibility of chiplet technology with our proven whole-vehicle approach. Together with our partners, we're solving real industry challenges — from energy efficiency to AI-driven experiences — to make the software-defined vehicle revolution a reality for all," said Jack Weast, vice president and general manager of Intel Automotive.