Xiaomi will be debuting its 18 Fold smartphone and Pad 9 Pro Max tablet, with both gadgets set to debut in China in September, according to a post on Chinese social media platform Weibo on Monday.
The 18 Fold smartphone is meant to be the company's flagship foldable mobile device, similar to contemporaries such as Samsung's Galaxy Z Fold 8, Google's Pixel 11 Pro Fold and Oppo's Find N6. Its GPU's (graphics processing unit) performance beat the Apple A19 Pro in select metrics as per data shared by Xiaomi cited by GSMArena.
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Both devices will be powered by its in-house AI mobile processor, called the Xring O3 system-on-a-chip, which is expected to compete with its peers in the semiconductor space such as Qualcomm and MediaTek Inc.
The chip is manufactured via a 3-nanometer (nm) fabrication process as per a post on WeChat by Lei Jun, the company's founder. This is similar to the tech used in Apple's latest A19 Pro chips and more advanced than its rival Huawei's chips. The firm has partnered with TSMC (Taiwan Semiconductor Manufacturing Co.) to make the chip, as per Reuters.
The aforementioned manufacturing process will allow Xiaomi to pack more transistors into the same amount of silicon, which is expected to make the chip work faster and consume less power.
The Xring O3 saw a score of 5,228,014 points in the AnTuTu V11 benchmark, indicating that it is likely to be a cut above its peers in terms of performance.
The company also launched the Xring 0100, which is a 6 nm chip that is meant to speed up the efficiency and speed of AI and machine learning tasks, acting as an 'AI accelerator'. The chip stacks its memory directly on its processor, leading to 1.22 TB/s of near-memory bandwidth. This will be used to power the AI used in phones, cars and robots.
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